Week In Review: Manufacturing, Test
Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the...
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Recovery In Flat-Panel Display Biz
The flat-panel display market is starting to recover after a period of oversupply and lackluster growth, fueled by new technologies as well as more people working from home. The flat-panel display...
View ArticleWeek In Review: Design, Low Power
AI Mythic debuted its Analog Matrix Processor for edge AI applications such as smart home, AR/VR, drones, video surveillance, smart city, and industrial. The M1108 AMP combines 108 tiles made up of an...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers and OEMs Third Point, a hedge fund, released a letter, saying that Intel needs to explore its strategic alternatives. This includes the breakup of the chip giant. Obtained by Yahoo and...
View ArticleWeek In Review: Manufacturing, Test
Government policy At one point, there was a school of thought that the Biden administration would relax the current tariffs and export controls in regards to China. So far, the Biden administration...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes,...
View ArticleWeek In Review: Auto, Security, Pervasive Computing
The great EV ramp EV-related developments are everywhere. California’s move to ban sales of new internal-combustion vehicles by 2035, and the U.S. government’s sweeping embrace of clean-energy, are in...
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Multiple Hurdles In The Race To 6G
The rollout of 6G will open the door to significant changes and possibilities, but whether this technology lives up to the hype will require massive collaborative efforts, huge investments in...
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Chip Industry Week In Review
By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will...
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Chip Industry Week in Review
Lawrence Livermore National Laboratory is ramping up R&D for next-gen EUV and plasma-based particle sources, aiming to increase the EUV laser source power by an order of magnitude while also making...
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